PROCESS FOR CREATING VIAS FOR CIRCUIT ASSEMBLIES

摘要

PROVIDED IS A PROCESS FOR CREATING VIAS FOR A CIRCUIT ASSEMBLY INCLUDING THE STEPS OF (A) APPLYING A CURABLE COATING COMPOSITION TO A SUBSTRATE, SOME OR ALL OF WHICH IS ELECTRICALLY CONDUCTIVE, TO FORM AN UNCURED COATING THEREON; (B) APPLYING A RESIST OVER THE UNCURED COATING; (C) IMAGING THE RESIST IN PREDETERMINED LOCATIONS; (D) DEVELOPING THE RESIST TO EXPOSE PREDETERMINED AREAS OF THE UNCURED COATING; (E) REMOVING THE EXPOSED AREAS OF THE UNCURED. COATING; AND (F) HEATING THE COATED SUBSTRATE OF STEP (E) TO A. TEMPERATURE AND FOR A TIME SUFFICIENT TO CURE THE COATING. ALSO DISCLOSED IS A PROCESS OF FABRICATING A CIRCUIT ASSEMBLY.