发明名称 APPARATUS OF ALIGNING AN EPOXY MOLDING COMPOUND AND AUTO MOLDING SYSTEM HAVING THE SAME
摘要 An apparatus for aligning an epoxy molding compound and auto molding system having the same are provided to drop the epoxy molding compound to the transfer part of the epoxy molding compound effectively. An apparatus for aligning an epoxy molding compound comprises the epoxy mold compound conveying section(200) arranging the epoxy mold compound to make the row and transferring; the first pusher portion(300) for pushing the epoxy mold compound delivered from the epoxy mold compound conveying section in the horizontal direction; the dropping part(400) for serving the space in which the epoxy mold compound pushed with the first pusher portion falls down; the second pusher portion(500) pushing the epoxy molding compound to the down direction as the set up times and dropping from compulsorily, in case the epoxy mold compound is not dropped down earlier than normally; the epoxy mold compound transfer portion having one or more holders for arranging the epoxy mold compound dropped down.
申请公布号 KR20080103763(A) 申请公布日期 2008.11.28
申请号 KR20070050916 申请日期 2007.05.25
申请人 SECRON CO., LTD. 发明人 JUNG, BYUNG HO;KIM, BYUNG HO
分类号 H01L21/50;H01L21/48 主分类号 H01L21/50
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