| 摘要 |
A SEMICONDUCTOR PACKAGE (50) COMPRISES A LEADFRAME (56) WITH A CENTRAL FLAG PORTION (54) ON WHICH A SEMICONDUCTOR DIE (52) IS DISPOSED. ENDS OF FLAT CLIPS (62) ARE SOLDERED TO SOLDER PADS (60) ON THE SEMICONDUCTOR DIE (52), AND ON FREE ENDS (61) OF PREFORMED LEAD PORTIONS (58) THAT SURROUND THE FLAG PORTION (54). THE SEMICONDUCTOR DIE (52), THE CLIPS (62), THE FREE ENDS (61), AND ALL BUT A LOWER SURFACE OF THE FLAG PORTION (54) ARE ENCAPSULATED IN MOULD COMPOUND (66) TO FORM THE SEMICONDUCTOR PACKAGE (50) HAVING AN OUTLINE (68), WHICH IS THEN SINGULATED FROM THE LEAD FRAME (56).FIG. 5 AND 6
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