SEMICONDUCTOR DEVICE PACKAGE TO IMPROVE FUNCTIONS OF HEAT SINK AND GROUND SHIELD

摘要

Semiconductor Device Package to Improve Functions of Heat Sink and Ground Shield The present invention provides a package structure and a method for forming the same. The structure comprises a substrate with contact pads and through holes filled with conducting metals for performing heat dissipation and ground shielding. A chip with bonding pads is attached on the contact pad by an adhesive with high thermal conductivity to achieve heat dissipation. A RDL is formed on the substrate and the chip to couple the bonding pad and the contact pad formed on the substrate. The structure of present invention can improve the thickness thereof, and the heat dissipation and ground shielding of the structure are enhanced. Furthermore, the structure can achieve package on package (PoP) structure.