发明名称 ELECTRONIC DEVICE, AND MOLDING DIE THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide an electronic device capable of suppressing the position deviation and inclination of an electronic circuit part by a resin injection pressure and securing a waterproof property without adding a new process, and to provide a molding die therefor. SOLUTION: An acceleration sensor unit comprises an electronic circuit part, a case and a connector housing, and the case and the connector housing are molded by a cavity 24 for the case and a cavity 25 for the housing. After a melted resin 3 is injected to the molding die 2 until it is cooled and solidified, the electronic circuit part 10 is held in holding parts 220a-220d. Thus, the position deviation or the like by the resin injection pressure is suppressed. After it is cooled and solidified, when the acceleration sensor unit is taken out, a hole part is formed by the holding parts 220a-220d. However, the opening of the hole part is surrounded by the connector housing. Thus, the waterproof property is secured without adding the new process of sealing the hole part. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008288448(A) 申请公布日期 2008.11.27
申请号 JP20070133190 申请日期 2007.05.18
申请人 DENSO CORP 发明人 WATANABE TATSUYA;IMOTO MASAHIKO;GOSHIMA YOSHIYA
分类号 H01L21/56 主分类号 H01L21/56
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