| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging module capable of highly accurately and easily constituting an imaging apparatus, to provide the imaging apparatus to which such a solid-state imaging module is applied, and to provide a method of manufacturing such a solid-state imaging module. SOLUTION: The solid-state imaging module 1 includes a solid-state imaging element 11 including a photo-detection unit 11r wherein a pixel for photoelectric-converting incident light into an electric signal is disposed, and a translucent protection unit 13 protecting the photo-detection section 11r. The translucent protection unit 13 includes a light guide section 13t guiding the incident light to the photo-detection unit 11r, a frame-like abutting section 13b which is disposed around the light guide section 13t and abutted to a surface of the solid-state imaging element 11 around the photo-detection unit 11r, and a light guide supporting section 13w which is coupled with the frame-like abutting section 13b and supports the light guide section 13t. The frame-like abutting section 13b (translucent protection unit 13) is positioned with respect to the photo-detection unit 11r by a positioning mark 11m provided around the photo-detection unit 11r. COPYRIGHT: (C)2009,JPO&INPIT
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