| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device wherein a semiconductor chip and a lead frame are covered with resin and information on the manufacturing process of the semiconductor chip is visibly printed. SOLUTION: In this semiconductor device 10, a semiconductor chip 14 is stuck on the surface of an island 12 of a lead frame 11. Manufacturing information 20 on the position of the semiconductor chip within the semiconductor wafer plane at least in the manufacturing process thereof is printed on the rear surface of the island 12 so that it may become visible when X ray is given thereto. Since the manufacturing information 20 is printed on the rear side of the island 12, it is made more readable by applying X-ray than in a case when it is printed on the surface or the rear surface of the semiconductor chip 14. COPYRIGHT: (C)2009,JPO&INPIT
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