摘要 |
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices includes (a) a first microelectronic die having a first side and a second side opposite the first side, (b) a first substrate attached to the first side of the first microelectronic die and electrically coupled to the first microelectronic die, (c) a second substrate attached to the second side of the first microelectronic die, (d) a plurality of electrical couplers attached to the second substrate, (e) a third substrate coupled to the electrical couplers, and (f) a second microelectronic die attached to the third substrate. The electrical couplers are positioned such that at least some of the electrical couplers are inboard the first microelectronic die. |
申请人 |
MICRON TECHNOLOGY, INC.;YE, SENG KIM, DALSON;CHONG, CHIN, HUI;LEE, CHOON, KUAN;LEE, WANG, LAI;SAID, ROSLAN, BIN |
发明人 |
YE, SENG KIM, DALSON;CHONG, CHIN, HUI;LEE, CHOON, KUAN;LEE, WANG, LAI;SAID, ROSLAN, BIN |