| 摘要 |
A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 mum and has at least one of: a) a brittleness ratio less than about 9.5 (mum)-1/2, or b) a fracture toughness of at least about 0.75 MPa.(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 mum and having at least one of: a) a brittleness ratio of less than about 9.5 (mum)-1/2, or b) a fracture toughness of at least about 0.75 MPa.(m)1/2; and then forming a substrate from the selected inorganic material.
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