MANUFACTURING METHOD AND STRUCTURE OF SURFACE BONDING TYPE DIODE FRAME

摘要

PROBLEM TO BE SOLVED: To ensure the more accurate size of a molded function area with design by which a molding bolt and a positioning bolt can be placed respectively in contact with a metal pin and to increase a yield in the manufacturing process by lowering a generation rate of burrs at a plastic base.

SOLUTION: In the manufacturing method and structure of the surface bonding type diode frame, the surface bonding type diode frame structure includes a plastic base and a plurality of metal pins. A concave function area is provided on the one end surface of the plastic base and a plurality of internally recessed reserve holes are formed on the other end surface opposing to the function area. The function area and reserve hole are molded by the molding bolt and positioning bolt provided within the mold.

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