| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor being usable for the production (sealing) of a semiconductor device, which is excellent in pot life, fluidity and curability, and is reduced in the content of a chloride ion. <P>SOLUTION: The epoxy resin composition for sealing a semiconductor comprises the following components (A) to (C), wherein the component (C) is dispersed in the epoxy resin composition: (A) an epoxy resin having at least two or more epoxy groups in one molecule, (B) a compound having two or more phenolic hydroxide groups in one molecule and (C) particles having such a particle diameter distribution that the maximum particle diameter is≤30μm and the standard deviation is≤5μm, and comprising a compound represented by general formula (1) (wherein, X<SB>1</SB>to X<SB>5</SB>are mutually the same or different, and each represent a hydrogen atom, a 1-9C alkyl group or a fluorine atom). <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
