发明名称 |
ELECTRONIC COMPONENT COMPRISING A TITANIUM CARBONITRIDE (TiCN) BARRIER LAYER AND PROCESS OF MAKING THE SAME |
摘要 |
An electronic component comprising several superimposed layers of materials including a TiCN barrier layer. A process for depositing a TiCN layer in order to obtain an electronic component, where a titanium precursor is chosen from among tetrakis (dimethylamido) titanium and/or tetrakis (diethylamido) titanium and is decomposed on a substrate by plasma-enhanced atomic layer deposition (PEALD) where the plasma is obtained with a hydrogen-rich gas which can contain nitrogen with at most 5 atomic % nitrogen and at least 95 atomic % hydrogen.
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申请公布号 |
US2008290417(A1) |
申请公布日期 |
2008.11.27 |
申请号 |
US20080112903 |
申请日期 |
2008.04.30 |
申请人 |
STMICROELECTRONICS SA |
发明人 |
CAUBET PIERRE;BENABOUD RYM |
分类号 |
H01L27/092;H01L21/318;H01L23/52;H01L29/92 |
主分类号 |
H01L27/092 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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