发明名称 DUAL TRENCH ISOLATION FOR CMOS WITH HYBRID ORIENTATIONS
摘要 The present invention provides a semiconductor structure in which different types of devices are located upon a specific crystal orientation of a hybrid substrate that enhances the performance of each type of device. In the semiconductor structure of the present invention, a dual trench isolation scheme is employed whereby a first trench isolation region of a first depth isolates devices of different polarity from each other, while second trench isolation regions of a second depth, which is shallower than the first depth, are used to isolate devices of the same polarity from each other. The present invention further provides a dual trench semiconductor structure in which pFETs are located on a (110) crystallographic plane, while nFETs are located on a (100) crystallographic plane. In accordance with the present invention, the devices of different polarity, i.e., nFETs and pFETs, are bulk-like devices.
申请公布号 US2008290379(A1) 申请公布日期 2008.11.27
申请号 US20080169991 申请日期 2008.07.09
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHAN VICTOR;IEONG MEIKEI;RENGARAJAN RAJESH;REZNICEK ALEXANDER;SUNG CHUN-YUNG;YANG MIN
分类号 H01L21/8234;H01L29/04 主分类号 H01L21/8234
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