ADHESIVE COMPOSITION AND ADHESIVE FILM USING THE SAME
摘要
<p>Disclosed is a thermosetting adhesive composition containing (A) a modified polyamideimide resin which can be dissolved in an organic solvent, (B) a thermosetting resin, and (C) a curing agent or a curing accelerator.</p>
申请公布号
WO2008143253(A1)
申请公布日期
2008.11.27
申请号
WO2008JP59234
申请日期
2008.05.20
申请人
HITACHI CHEMICAL COMPANY, LTD.;NAKAMURA, SHIGEHIRO;ITOU, TOSHIHIKO;MANSEI, YOUICHIROU
