| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing the peeling caused by a difference in shrinkage coefficients of a metal island and a mold resin and having improved product reliability. <P>SOLUTION: A semiconductor device 10 of the present invention is provided with a metal island 12, a semiconductor chip 16 mounted on the metal island 12, and a mold resin layer 24 for sealing the metal island 12 and the semiconductor chip 16. The interface between the side face of the metal island 12 and the mold resin layer 24 is provided with a buffer film 13 with an elastic modulus lower than that of the mold resin layer 24. <P>COPYRIGHT: (C)2009,JPO&INPIT |
