| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processor and a substrate processing method that allow coating removal performance to be fully exerted while achieving reduction in occurrence frequency of pinholes when removing each end-edge-part coating by discharging processing liquid to each end-edge-part coating on the surface of each end edge part of a substrate in coatings formed on the substrate surface. SOLUTION: In a processing-liquid discharge initial step, the discharge of processing liquid toward each end-edge-part coating 16 is started. In a processing-liquid discharge final step, the discharge of processing liquid is stopped. In the processing-liquid discharge initial step and the processing-liquid discharge final step, it is set to reduce the processing-liquid discharge flow rate, discharged from a processing-liquid discharge nozzle 5, by branching and allowing processing liquid, flowing in a processing-liquid supply pipe 6, to flow into bypass piping 10 in order to reduce the occurrence frequency of pinholes. In a processing-liquid discharge intermediate step, it is set to increase the processing-liquid discharge flow rate in order to completely remove each end-edge-part coating 16. COPYRIGHT: (C)2009,JPO&INPIT
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