| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a photoresist stripping agent composition which can peel the photoresist without corroding aluminum or aluminum alloy wiring and also Cu or Cu alloy wiring in a FPD manufacturing processes. <P>SOLUTION: This photoresist stripping agent composition containes 0.05-10 wt.% of at least one kind of heterocyclic compounds selected from groups of maltol, 2,6-dimethyl gamma pyron, 4-hydroxy-6-methyl-2-pyron, 4-hydroxy coumarin, 2,4-didydro xykinoline, 2-amino-4,6-dihydroxy pyrimidine, 2,4-diamino-6-hydroxy pyrimidine, 2-amino-4-hydroxy-6-methyl pyrimidine, 4,6-dimethyl-2-hydroxy pyrimidine, uracil, and 6-methyl uracil; 5-45 wt.% of first or second class alkanolamine or alkylamine; 30-94.85 wt.% of polar organic solvents, and 0.1-10 wt.% of sugar alcohols. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
