| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold package soldered to a board via leads exposed out of the undersurface of a mold resin, which mold package enables display of a first pin without printing on the mold resin and beveling an island portion. SOLUTION: On the periphery of the undersurface 42 of the mold resin 40, the front ends of respective suspension leads 13 are exposed out of the mold resin 40, and are formed into reinforcing terminals 141 to 144 soldered to the board 200. One reinforcing terminal 141 of the reinforcing terminals 141 to 144 is made a shape exposed out of the mold resin 40 that is different from the shape of other reinforcing terminals 142 to 144. The first pin in a plurality of leads 12 is recognized using one reinforcing terminal 141 as a reference. COPYRIGHT: (C)2009,JPO&INPIT
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