MULTILAYER WIRING BOARD, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To achieve a multilayer wiring board capable of obtaining a higher interconnect flexibility, cutting material cost, and reducing substrate capacitance.

SOLUTION: At least a sheet of a substrate 21 with a wiring circuit subjected to contour processing in advance is attached to a motherboard printed wiring board 10. The substrate and the board are electrically connected at least at one location by an inner via hole 24. An outer shape of the substrate 21 with the wiring circuit is smaller than that of the motherboard printed wiring board 10. The substrate 21 with the wiring circuit has an island shape on the motherboard printed wiring board 10.

COPYRIGHT: (C)2009,JPO&INPIT