发明名称 METHOD FOR PRODUCING MOLDING SUBJECTED TO ELECTROLESS PLATING
摘要 PROBLEM TO BE SOLVED: To provide a method for producing a molding where, after electroless plating treatment or electroplating treatment, a molding in which electroless plating is applied to a recessed part and/or a projecting part can be easily produced without removing an electroplating layer or an electroless plating layer. SOLUTION: An independent recessed part and/or projecting part whose surface is at least composed of a hydrophobic resin is provided on a hydrophilic non-conductive member, thereafter, a catalyst is stuck to the recessed part and/or projecting part, and electroless plating is performed. Alternatively, a die with an independent recessed part formed is filled with a hydrophilic resin, the die is brought into contact with a non-conductive member whose surface is at least hydrophobic, an independent projecting part composed of a hydrophilic resin is transferred to the surface of the hydrophobic non-conductive member, thereafter, a catalyst is stuck to the projecting part, and electroless plating is performed. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008285723(A) 申请公布日期 2008.11.27
申请号 JP20070131942 申请日期 2007.05.17
申请人 KIMOTO & CO LTD 发明人 KITAMURA YOSHIKO;SHIMIZU KOJI;OTA TETSUJI
分类号 C23C18/30 主分类号 C23C18/30
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