| 摘要 |
PROBLEM TO BE SOLVED: To provide a low hygroscopic and highly heat-resistant epoxy compound (epoxy resin) and its manufacturing method. SOLUTION: The epoxy compound containing a fluorene ring is represented by general formula (1). The compounds of general formula (1) are manufactured by glycidyl etherification of 9,9-bis(dihydroxyphenyl)fluorenes prepared by causing fluorenone to react with a dihydric phenol. The dihydric phenol is preferably resorcinol or catechol. COPYRIGHT: (C)2009,JPO&INPIT
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