| 摘要 |
The invention provides an electronic circuit module capable of reliably mounting a chip to a multi-layer wiring plate in a flip chip manner. In an electronic circuit module according to an embodiment of the invention, a chip including bumps with a height of d is mounted to a multi-layer wiring plate including surface electrodes and internal electrodes in a flip chip manner. In the multi-layer wiring plate, when the minimum thickness of the surface electrode and the internal electrodes overlapping each other below each of the bumps is TD and the maximum thickness of the surface electrode and the internal electrodes overlapping each other in a space surrounded by the bumps is TI, the surface electrodes and the internal electrodes are arranged so as to satisfy TI<TD+d.
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