Method for Manufacturing Dielectric Layer Constituting Material, Dielectric Layer Constituting Material Obtained Thereby; Method for Manufacturing Capacitor Circuit Forming Piece Using Dielectric Layer Constituting Material, Capacitor Circuit Forming Piece Obtained Thereby; and Multi-Layer Printed Wiring Board Obtained by Using Dielectric Layer Constituting Material and/or Capacitor Circuit Forming Piece

摘要

An object is to obtain a dielectric layer constituting material, a capacitor circuit forming piece, etc. in which unnecessary dielectric layer is removed except capacitor circuit parts that improve accuracy of position of an embedded capacitor circuit in a multi-layer printed wiring board. For the purpose of achieving the object, "a method for manufacturing a dielectric layer constituting material characterized in that step a is a step for forming a first electrode circuit by etching a conductor layer on one side of a metal clad dielectric comprising a conductor layer on each side of a dielectric layer; step b is a step for removing the dielectric layer that is exposed between the first electrode circuits to manufacture the dielectric layer constituting material; and the step a is conducted and then the step b is conducted" is adopted. Then as a process for manufacturing a capacitor circuit forming piece, the dielectric layer constituting material obtained above is used and a process for forming a second electrode at a position facing the first electrode is conducted.