<p>The invention provides an adhesive comprising structurally modified, pyrogenically prepared silicas containing on their surface organosilane groups of the formula (I) SiC<SUB>n</SUB>H<SUB>(2n+1)</SUB>, where n is 2 to 18. The invention further provides for the use of these structurally modified, pyrogenically prepared silicas in adhesives.</p>
申请公布号
WO2008141926(A1)
申请公布日期
2008.11.27
申请号
WO2008EP55560
申请日期
2008.05.06
申请人
EVONIK DEGUSSA GMBH;SCHOLZ, MARIO;MEYER, JUERGEN;ZEIZINGER, HORST;BUCKEL, PIA
发明人
SCHOLZ, MARIO;MEYER, JUERGEN;ZEIZINGER, HORST;BUCKEL, PIA
