| 摘要 |
A unit for heating a substrate and an apparatus for bonding a chip having the unit for heating a substrate is provided to prevent the upper heating plate from being shaken using the second plate and the axis extended from the first retention element supporting the heating plate. A unit for heating a substrate comprises the heating plate(110) for heating up the substrate; the first retention element(120) for supporting the lower surface of the upper heating plate; the driving part(130) which is connected to the first retention element and raise the first retention element; the base plate(140) supporting the lower surface of the driving part; the second supporting member(150) having the penetration hole; the axis(160) guiding the second supporting member getting on and off according to the drive of the driving part. The second supporting member is extended to the side direction from the first retention element. |
