发明名称 |
MILLIMETER WAVE INTEGRATED CIRCUIT INTERCONNECTION SCHEME |
摘要 |
A millimeter-wave integrated circuit (IC) package is disclosed. The package includes a substrate having a plurality of layers and a vertical interconnection. The vertical interconnection comprises a shielded transition between the plurality of layers and a compensation structure to minimize the parasitic effect of the transition.
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申请公布号 |
US2008290959(A1) |
申请公布日期 |
2008.11.27 |
申请号 |
US20070752073 |
申请日期 |
2007.05.22 |
申请人 |
ALI MOHAMMED ERSHAD;ZARNAGHI ROKHSAREH;DOAN CHINH HUY |
发明人 |
ALI MOHAMMED ERSHAD;ZARNAGHI ROKHSAREH;DOAN CHINH HUY |
分类号 |
H03H7/38 |
主分类号 |
H03H7/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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