摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a polishing pad (polishing layer) which is superior in its flattening characteristics, and can suppress the generation of scratches, and can perform polishing at a high polishing speed. <P>SOLUTION: A reinforcing layer formed by plating copper on a non-woven fabric or a woven fabric is preliminarily arranged in a die. Then, an Sn composite containing a metallic component including irregular shape Sn powder and/or Sn alloy powder produced by the water atomization method, thermoplastic resin such as polyurethane and/or thermoplastic elastomer, and an organic solvent is poured into the die. After that, a metallic sheet is manufactured by removing the organic solvent. Then, the metallic sheet is pressed in a hot state so as to reduce the electric resistance of the polishing sheet and so as to make its surface smooth. <P>COPYRIGHT: (C)2009,JPO&INPIT |