SEMICONDUCTOR WAFER POLISHING COMPOSITION, MANUFACTURING METHOD THEREOF, AND POLISH TREATMENT METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wiring metal polishing composition which does not produce a scar called scratch and has a high polish rate in polishing a substrate having a metal such as wiring formed on a semiconductor wafer, to provide a manufacturing method, and to provide a polishing method.

SOLUTION: There are provided a semiconductor wafer polishing composition which contains acid, pH of which is 2 to 6, and which contains an aqueous medium dispersion liquid of a positively-charged silica particle on the surface of which an amino-containing silane coupling agent is coupled, and a polish treatment method using the polishing composition.

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