| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve a light emitting element having a good luminous efficiency in which light emitted directly under a bonding electrode can be effectively taken outside. <P>SOLUTION: The manufacturing method of a light emitting element in which a plurality of light emitting element units each having a first bonding electrode and a second bonding electrode are collectively formed on a wafer having a transparent substrate, includes steps of: forming a first semiconductor layer and a second semiconductor layer on the transparent substrate in this order; forming a plurality of first bonding electrodes on the first semiconductor layer; and forming a plurality of second bonding electrodes on the second semiconductor layer. Wherein, the first and the second bonding electrodes are arranged in parallel so that the outer shape of the light emitting element unit becomes rectangular in a plane view, and the plurality of first and second bonding electrodes are arranged adjacently in parallel with each other, respectively, so that a plurality of light emitting element units are arranged adjacently in parallel with each other. <P>COPYRIGHT: (C)2009,JPO&INPIT |
