发明名称 METHOD FOR PRODUCING MOLDING SUBJECTED TO ELECTROLESS PLATING, AND METHOD FOR PRODUCING ELECTRODE MEMBER FOR TOUCH PANEL
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for producing a molding where, after electroless plating treatment or electroplating treatment, a molding in which electroless plating is applied to the part other than a recessed part or a projecting part can be easily produced without removing an electroplating layer or an electroless plating layer, and to provide a method for producing an electrode member for a touch panel. <P>SOLUTION: An independent recessed part or projecting part whose surface is at least composed of a hydrophobic resin is provided on a non-conductive member whose surface is at least hydrophilic, thereafter, a catalyst is stuck to the part other than the recessed part or projecting part, and electroless plating is performed. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2008285724(A) 申请公布日期 2008.11.27
申请号 JP20070131943 申请日期 2007.05.17
申请人 KIMOTO & CO LTD 发明人 KITAMURA YOSHIKO;SHIMIZU KOJI;OTA TETSUJI
分类号 C23C18/18;C23C18/30;G06F3/041 主分类号 C23C18/18
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