| 摘要 |
<p>A coupling method of the soldered type light emitting diode chip is provided to improve the die bonding and thermo-electric effect of the light emitting diode by adjusting the thickness of solder in the range of 4mum or 5mum. A coupling method of the soldered type light emitting diode chip includes the step for preparing the copper substrate(100); the step for forming the insulating layer on the copper substrate(102); the step for forming the conductive layer on the insulating layer(104); the step for coating the solder paste on the fixed position on the conductive layer with the silkscreen print manner(106); the step for arranging the chip on the solder paste coated onto(108); the step for melting by supplying the heat(110); the step for cooling the copper substrate(112).</p> |
