| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To sustain high reliability even if a chip component is connected to a first substrate with a wire in a process for producing a built-in chip substrate where a chip is built in between a pair of substrates. <P>SOLUTION: The process for producing a built-in chip substrate comprises a step for connecting a chip component 13 to a first substrate 10 with a wire 14, a step for providing an electrode 21 on a second substrate 20, a step for forming a first sealing resin 34 which seals the chip component 13 and the wire 14 by attaching a die 30 having a protrusion 31 formed in correspondence with an array of bump connection pads 12 on the first substrate 10 and a cavity 32 formed in correspondence with the mounting region of the chip component 13 to the first substrate 10, a step for bonding the first substrate 10 and the second substrate 20 by solder jointing the electrode 21 and bump connection pads 12, and a step for filling the gap portion of the first substrate 10 and the second substrate 20 with second sealing resin 40. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
