发明名称 METHOD OF LASER BEAM MACHINING, FLEXIBLE PRINTED CIRCUIT BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining technique which can prevent electrical defects due to the carbonization of a workpiece. <P>SOLUTION: In the laser beam machining method for machining a workpiece 11 mounted on a machining stage 12 by irradiating the workpiece 11 with the laser beam 18 radiated from a very short pulse laser beam source 1 via a condensing objective lens 10, the pulse width of the very short pulse laser beam 18 is set to be 500 fs (femtosecond) or less, and the irradiating energy at the machining point of the workpiece 11 is controlled so as to be 0.01 to 5 micro joule per cm<SP>2</SP>(μJ/cm<SP>2</SP>). As a result, the range of the carbonization from the machining point of the organic material portion of the workpiece 11 is controlled to be 0.05 mm or less so as to hardly cause electric troubles such as short circuit. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2008284577(A) 申请公布日期 2008.11.27
申请号 JP20070130715 申请日期 2007.05.16
申请人 OLYMPUS CORP 发明人 TAKIGUCHI KINJI;IMAMURA TOMONORI;HIDAKA TAKESHI
分类号 B23K26/00;B23K26/08;B23K101/42;H05K3/00 主分类号 B23K26/00
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