发明名称 LASER PLATING APPARATUS AND PLATED MEMBER
摘要 PROBLEM TO BE SOLVED: To provide a laser plating apparatus capable of partially plating a small area on an object of plating with high positional accuracy and a plated member plated by the laser plating apparatus. SOLUTION: The laser plating apparatus 10 comprises a plating bath 12 for bringing the object 80 into contact with a plating solution, a laser oscillator 14 for irradiating the object 80 to be plated passing through the plating solution with a laser to deposit a plating metal on the object 80, a transfer device 16 for transferring the object 80 to make pass through the plating solution in the plating bath 12, a photoelectric sensor 18 for detecting the position of a positioning hole of the object 80 which is transferred and a galvano-scanner 20 having a galvano-mirror 22 arranged on an optical path of the laser beam and capable of scanning the laser beam, and for returning the scan of the laser beam to a scan starting position by detecting the position of the positioning hole by the photoelectric sensor 18. And, the plated member is finely spot-plated by the laser plating apparatus 10. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008285696(A) 申请公布日期 2008.11.27
申请号 JP20070129119 申请日期 2007.05.15
申请人 AUTO NETWORK GIJUTSU KENKYUSHO:KK;SUMITOMO WIRING SYST LTD;SUMITOMO ELECTRIC IND LTD 发明人 HAGA KOKICHI
分类号 C25D5/02;C25D17/00;G06T1/00 主分类号 C25D5/02
代理机构 代理人
主权项
地址