发明名称 Method for fabricating multi-resistive state memory devices
摘要 A treated conductive element is provided. A conductive element can be treated by depositing either a reactive metal or a very thin layer of material on the conductive element. The reactive metal (or very thin layer of material) would typically be sandwiched between the conductive element and an electrode. The structure additionally exhibits non-linear IV characteristics, which can be favorable in certain arrays.
申请公布号 US2008293196(A1) 申请公布日期 2008.11.27
申请号 US20080215958 申请日期 2008.06.30
申请人 UNITY SEMICONDUCTOR CORPORATION 发明人 RINERSON DARRELL;KINNEY WAYNE;WARD EDMOND R.;HSIA STEVE KUO-REN;LONGCOR STEVEN W.;CHEVALLIER CHRISTOPHE J.;SANCHEZ JOHN;SWAB PHILIP F.S.
分类号 H01L21/8244;G11C11/16;G11C11/56;G11C13/00;H01L27/24 主分类号 H01L21/8244
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