发明名称 Ultrasonic probe and manufacturing process thereof
摘要 The invention relates to an ultrasonic probe in which the array accuracy of lead wires, and heat resistance when connecting to a connector are enhanced, and a manufacturing method therefor. The ultrasonic probe of the invention is one in which a plurality of piezoelectric elements are arrayed in a two-dimensional direction on a fixing base, and lead wires from the lower surface of each of the piezoelectric elements are inserted through the fixing base, and the electrically connected lead wires are led out, and the fixing base has an opening portion in an array direction of the piezoelectric elements, and comprises unit fixing plates laminated in the array direction, and grooves through which the lead wires are inserted, are formed on one principal surface of the unit fixing plates, and damper material is filled into the opening portion. The invention is also for a manufacturing method for the ultrasonic probe.
申请公布号 US2008294053(A1) 申请公布日期 2008.11.27
申请号 US20070891106 申请日期 2007.08.09
申请人 NIHON DEMPA KOGYO CO., LTD. 发明人 TAHARA YOSHIHIRO;SHIMURA ISAMU;KONDOH TAKASHI
分类号 A61B8/00;G01N29/24;B06B1/06;H01L41/04;H04R17/00;H04R31/00 主分类号 A61B8/00
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