| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve problem of poor contact and lifting, by improving adhesion strength when an photoelectric conversion element is mounted on a wiring board and the like. <P>SOLUTION: The semiconductor device includes a photoelectric conversion layer on a first substrate; an amplifier made up of at least two thin film transistors for amplifying an output current of the photoelectric conversion layer; a first electrode connected electrically with the photoelectric conversion layer and the amplifier for applying high potential power and a second electrode for applying low potential power; an adhesion layer for forming conductive material and alloy on the upper layer of the first substrate; a third electrode and a fourth electrode on the second substrate; and conductive material for adhering the first electrode, the third electrode, and the second electrode and the fourth electrode. <P>COPYRIGHT: (C)2009,JPO&INPIT |
