SEMICONDUCTOR CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

A semiconductor chip package and the manufacturing method thereof are provided to easily form the pattern formation of the thermal intermediate material layer by improving the opening structure of the heat sink and the corer. A semiconductor chip package comprises the circuit board(111); the semiconductor chip(113) electrically connected to the single-side of the circuit board; the cover(114) which is combined to the one side of the circuit board while accommodating the semiconductor chip to inside; the heat sink(150) combined to the upper side of cover; the thermal intermediate material layer(130) interposed between the cover and the heat sink; the concavo-convex region(114c) formed on the cover which contacted with the thermal intermediate material layer or the heat sink.