TEMPERATURE CONTROL METHOD OF CHARACTERISTIC COMPENSATION RING IN SUBSTRATE HOLDER PLASMA TREATMENT EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To suppress variations in the temporal temperature rise of a characteristic compensation ring in order to eliminate variations in treatment characteristic. SOLUTION: A substrate 10 is held by a substrate holder when predetermined treatment is applied to the substrate 10 using a plasma P in a treatment chamber. The substrate 10 is subjected to heat exchange through a substrate holding surface 20 to be regulated in temperature by a substrate temperature control mechanism 5. The characteristic compensation ring 9 that compensates the variations in processing characteristic at the periphery of the substrate 10 is provided so as to surround the periphery of the substrate 10. The characteristic compensation ring 9 is cooled by a cooling means which serves also as the substrate temperature control mechanism 5, and prevents the temporal temperature rise caused by the accumulation of heat from the plasma P. A temperature in the characteristic compensation ring 9 is controlled to conform to a temperature of the treatment. The thermally contacting performance of the characteristic compensation ring 9 to a holder body 1 is improved by a contacting performance improving means such as an electrostatic attraction mechanism 6 and the like. COPYRIGHT: (C)2009,JPO&INPIT