| 摘要 |
A light emitting device module is provided. The light emitting device module includes a plurality of light emitting devices; a submount on which the light emitting devices are mounted; and a heat-radiant substrate to which the submount is fixed. The submount includes a positive front surface electrode; a negative front surface electrode; at least one relay front surface electrode, wherein the plurality of light emitting devices are electrically coupled to each other in series via the at least one relay front surface electrode; a plurality of through electrodes; a positive back surface electrode coupled to the positive front surface electrode via a through electrode; a negative back surface electrode coupled to the negative front surface electrode via a through electrode; and at least one relay back surface electrode which is coupled to the at least one relay front surface electrode via a through electrode. The heat-radiant substrate includes a positive circuit electrode bonded to the positive back surface electrode; a negative circuit electrode bonded to the negative back surface electrode; and at least one relay circuit electrode bonded to the at least one relay back surface electrode and being floated electrically.
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