SEMICONDUCTOR PACKAGE, METHOD OF FORMING THE SAME, PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE

摘要

A semiconductor package, a method for forming the same, a printed circuit board and an electronic device are provided to prevent the molding film from being strip off and the wire from being swept away. The formation method of the semiconductor package includes the step for preparing the printed circuit board having the scribe region(110); the step for forming the hole(160) for molding on the chip area(120) between the scribe region and the built-in region; the step for setting up the semiconductor chip on the built-in region of the printed circuit board; the step for injecting the molding film into the hole for molding; the step for cutting the printed circuit board along the scribe region.