| 摘要 |
<p>A method which comprises bringing a plating remover consisting of an aqueous solution which contains 1.6% by mass of fluoroboric acid in terms of boron element, at most 0.2% by mass of boron compounds in terms of boron element, and at most 1% by mass of thiourea into contact with a sample constituted of a cupper- or brass-made base material and a tin or tin alloy plating layer formed thereon or a sample constituted of a metal base material, a copper- or brass-made substrate layer formed on the base material, and a tin or tin alloy plating layer formed on the substrate layer to dissolve the plating layer and then subjecting the resulting plating remover containing dissolved substance to quantitative analysis.</p> |
