FABRICATING METHOD OF PASTE BUMP FOR PRINTED CIRCUIT BOARD

摘要

A method for forming a paste bump of a PCB(Printed Circuit Board) is provided to reduce its fabrication coast and processing time by decreasing the number of printing when forming a paste bump on the PCB. A plate is prepared, and a first paste bump is formed on the plate after printing a conductive paste by using a first mask in which a hole of a first size is formed(S10,S20). The surface of the first paste bump is flattened through a coining process(S30). A second mask has a hole of a second size lower smaller than the hole of the first size and has a height lower than that of the first mask. A second paste bump is formed by being dried after printing a conductive paste on the first paste bump by using the second mask(S40,S50).