| 发明名称 |
CURABLE EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition which is excellent in fluidity in molding and forms a cured product having low elastic modulus by curing the composition. <P>SOLUTION: The curable epoxy resin composition comprises (I) an epoxy resin, (II) a curing agent for the epoxy resin and (III) crosslinked silicone particles prepared by binding a secondary amino group represented by general formula: R<SP>1</SP>NH-R<SP>2</SP>- (wherein R<SP>1</SP>is an aryl group or an aralkyl group; R<SP>2</SP>is a divalent organic group) to a silicon atom forming crosslinked silicone particle and used in an amount of 0.1-100 pts.wt. based on 100 pts.wt. total amount of the component (I) and the component (II). <P>COPYRIGHT: (C)2009,JPO&INPIT |
| 申请公布号 |
JP2008285553(A) |
申请公布日期 |
2008.11.27 |
| 申请号 |
JP20070130547 |
申请日期 |
2007.05.16 |
| 申请人 |
DOW CORNING TORAY CO LTD |
发明人 |
MORITA YOSHIJI;UEKI HIROSHI |
| 分类号 |
C08L63/00;C08G59/40;H01L23/29;H01L23/31 |
主分类号 |
C08L63/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
