| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a capacitor that does not adversely affect the characteristics of a dielectric layer even if forming a through hole or plating the through hole, to provide a method for manufacturing the capacitor, to provide a substrate incorporating the capacitor, and to provide a method of manufacturing the substrate incorporating the capacitor. <P>SOLUTION: The capacitor 100 has: a dielectric layer 10; a first capacitive electrode 21 formed on one main surface of the dielectric layer; and a second capacitive electrode 22 formed on the other main surface of the dielectric layer. The dielectric layer has a through conductor from one main surface to the other main surface, and a through hole is formed inside the through conductor. The substrate incorporating a capacitor has a substrate body having a wiring conductor, and the capacitor 100. In this case, the through conductor is connected to the wiring conductor electrically by a connection conductor formed inside the through hole. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
