| 摘要 |
PROBLEM TO BE SOLVED: To maintain high reliability by improving tight contact between a wiring layer and an insulating resin layer under the wiring layer by setting an interval to a fixed value or less even in a case where fine wiring of which a wiring width is 25μm or less is disposed on an outer-most layer which is easily damaged from an outer environment. SOLUTION: A multilayered wiring board includes three or more conductor wiring layers between which an insulating layer is disposed and a solder resist layer disposed on an outer-most layer. The multilayered wiring board is characterized in that, in the conductor wiring layers, wiring of the outer-most layer has a wiring width of 25μm or less and an interval of a wiring pattern of wiring is 30μm or less. COPYRIGHT: (C)2009,JPO&INPIT |
