发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT MODULE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit module capable of carrying out an individual compression scan test of a stored semiconductor integrated circuit without increasing an outside input and output terminal. SOLUTION: A scan output terminal 116 of the semiconductor integrated circuit 11 having a selection circuit 115 for outputting the input signal to a scan input terminal 111 connected to an outside scan input terminal 14 is connected to a scan input terminal 121 of a post-stage semiconductor integrated circuit 12 by being switched over to the output of a compression circuit 114. A scan output terminal 126 of the semiconductor integrated circuit 12 having a selection circuit 125 for outputting an input signal to the scan input terminal 121 is connected to a scan input terminal 131 of a post-stage semiconductor integrated circuit 132 by being switched over to the output of a compression circuit 124. The scan output terminal 126 of a semiconductor integrated circuit 13 having a selection circuit 135 for outputting the input signal to the scan input terminal 131 is connected to an outside scan output terminal 15 by being switched over to the output of a compression circuit 134. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008286553(A) 申请公布日期 2008.11.27
申请号 JP20070129720 申请日期 2007.05.15
申请人 TOSHIBA CORP 发明人 YASUKURA KENICHI
分类号 G01R31/28;H01L21/822;H01L27/04 主分类号 G01R31/28
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