发明名称 CONTROLLED ANNEALING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method for rapid thermal annealing. SOLUTION: A method for rapid thermal annealing is disclosed. When a substrate is inserted into an annealing chamber, heating starts by heat radiated from chamber components that have been heated when a previous substrate has been annealed. Thus, while the substrate is inserted, the tip of the substrate may have a raised temperature while the rear edge may have room temperature, thus causing a temperature gradient to be generated across the substrate. Even if the substrate is completely inserted in the annealing chamber, the temperature gradient may be generated. By compensating for the temperature gradient across the substrate, the substrate can be annealed uniformly. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008288598(A) 申请公布日期 2008.11.27
申请号 JP20080132074 申请日期 2008.05.20
申请人 APPLIED MATERIALS INC 发明人 RANISH JOSEPH MICHAEL;RAMACHANDRAN BALASUBRAMANIAN;JALLEPALLY RAVI;RAMAMURTHY SUNDAR;BEDAPLAM S ACHUTARAMAN;HAAS BRIAN;HUNTER AARON;ADERHOLD WOLFGANG
分类号 H01L21/26 主分类号 H01L21/26
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