发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE |
摘要 |
Provided are a semiconductor package and a method for forming the same, and a PCB (printed circuit board). The semiconductor package comprises: a PCB including a slit at a substantially central portion thereof, the PCB including an upper surface and a lower surface; a semiconductor chip mounted on the upper surface of the PCB; an upper molding layer disposed on the upper surface and covering the semiconductor chip; and a lower molding layer filling the slit and covering a portion of the lower surface of the PCB, wherein the PCB comprises a connecting recess at a side surface thereof, and the upper molding layer and the lower molding layer are in contact with each other at the connecting recess.
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申请公布号 |
US2008291652(A1) |
申请公布日期 |
2008.11.27 |
申请号 |
US20080124915 |
申请日期 |
2008.05.21 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SHIN MU-SEOB;KIM BYUNG-SEO;SON MIN-YOUNG;KWAK MIN-KEUN |
分类号 |
H05K7/00 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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