发明名称 SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE
摘要 Provided are a semiconductor package and a method for forming the same, and a PCB (printed circuit board). The semiconductor package comprises: a PCB including a slit at a substantially central portion thereof, the PCB including an upper surface and a lower surface; a semiconductor chip mounted on the upper surface of the PCB; an upper molding layer disposed on the upper surface and covering the semiconductor chip; and a lower molding layer filling the slit and covering a portion of the lower surface of the PCB, wherein the PCB comprises a connecting recess at a side surface thereof, and the upper molding layer and the lower molding layer are in contact with each other at the connecting recess.
申请公布号 US2008291652(A1) 申请公布日期 2008.11.27
申请号 US20080124915 申请日期 2008.05.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SHIN MU-SEOB;KIM BYUNG-SEO;SON MIN-YOUNG;KWAK MIN-KEUN
分类号 H05K7/00 主分类号 H05K7/00
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