| 摘要 |
In a semiconductor device, a package including the semiconductor device and a method of forming the same, the semiconductor device package includes a semiconductor device, a wiring board, and an underfill material layer. The semiconductor device includes a semiconductor chip, a metal layer, and solder balls for bump contacts. The semiconductor chip includes an active surface having bonding pads and a rear surface opposite the active surface and having concave portions corresponding to the bonding pads. The metal layer fills the concave portions and covers the rear surface. The solder balls for bump contacts are provided on the bonding pads. The wiring board includes an upper surface to which the semiconductor device is mounted and a lower surface opposite the upper surface. The underfill material layer fills a space between the active surface of the semiconductor device and the upper surface of the wiring board. The semiconductor device and the wiring board are electrically connected to each other by the solder balls for bump contacts of the semiconductor device and bonding electrodes included in the upper surface of the wiring board.
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